Showing 1–18 of 36 results
Provides optimized solution for all memory device/PKG and different test environments, from the smallest pitch ~ normal pitch (0.2P~1.0P).
Provides optimized solution for logic device/PKG test in accordance with the application, including long test time, short test time, high speed, large area, etc..
Provides customized, optimized solution through outstanding characteristics and structure, including Device No Ball Damage, PCB No Soldering, High Speed realization, etc., through rubber-applied Burn In Test Socket.
Provides RF test socket that responds to outstanding properties and high frequency by matching the impedance through unequaled technology and coaxial structure.
Capable of system test solution response against different packages, such as mobile, D-TV, network, module, etc., by using rubber and POGO socket.
Provides optimized wafer probing solution through the combination of high technology POGO probe and ultraprecision processing plate. High-performance MEMS probe head, applied with MEMS process, is capable of customized solution response by customer through low force, high CCC, and outstanding contact characteristics of high-strength material.
Pyramid PIN has high hardness (Hv1000), has outstanding contact properties through durability and sharp contact tip, and can provide customized solution response by customer.
Based on the best technology and know-how, Lithium-Polymer Battery It is suitable for charging and discharging test.
ISC’s auto socket can be produced into different shapes that corresponds to customer’s needs. Also, based on long experience in test socket market, it guarantees the best contact property and durability, and has a different kind of driving system than existing ones.