blueICE™ w/ Thermal Tape
ATS has a range of low-profile heat sinks and attachment technologies for electronics systems with limited space and airflow. From ultra-low-profile blueICE™ heat sinks to low-profile maxiFLOW™ and straight-fin heat sinks, ATS has solutions for tough-to-cool systems, such as telecommunications or IoT, where space is at a premium. Choose from several attachment methods, including thermal tape or high-performance maxiGRIP™ or superGRIP™.
| Dimensions | |
|---|---|
| Length (A) | 10.0 – 60.0 mm |
| Width (B) | 10.0 – 60.0 mm |
| Height (C) | 2.0 – 25.0 mm |
| Fin Tip to Fin Tip (D) | 10.0 – 60.0 mm |
- blueICE™ heat sinks feature an ultra low profile for tough-to-cool applications
- Designed for high performance in low air velocities
- Ideal for telecommunications applications where space is limited
- Comes pre-assembled with high performance thermal interface material
ATS’ blueICE™, ultra low profile heat sinks, can be applied to a wide variety of components, including:
- Altera
- AMD
- Freescale
- Intel
- TI
- Xilinx
* If you need Datasheet, CAD or RoHS, please contact us.
| Part Number | Equivalent Part# | Lifecycle Status |
Dimension (mm) | Thermal Resistance (R,°C/W) at Air Velocity(V,ft/min.) | R (Natural Convection) °C/W |
R (200 ft/min.) °C/W Ducted |
Fin Tip | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| L | W | H | V=200 | V=400 | V=600 | V=800 | ||||||
| ATS-60000-C1-R0 | ATS-60000-C2-R0 | ACTIVE | 25.2 | 25.2 | 4.0 | 14.8 | 9.6 | 6.9 | 5.3 | N/A | 7.8 | 34.8 |
| ATS-60001-C1-R0 | ATS-60001-C2-R0 | ACTIVE | 37.6 | 37.6 | 4.0 | 7.8 | 4.9 | 3.6 | 2.8 | N/A | 3.8 | 56.0 |
| ATS-60002-C1-R0 | ATS-60002-C2-R0 | ACTIVE | 58.2 | 61.0 | 5.5 | 4.0 | 2.5 | 1.8 | 1.5 | N/A | 2.3 | 66.3 |
| ATS-60003-C1-R0 | ATS-60003-C2-R0 | ACTIVE | 58.2 | 61.0 | 7.0 | 2.2 | 1.6 | 1.4 | 29.9 | N/A | 1.4 | 87.1 |
| ATS-60004-C1-R0 | ATS-60004-C2-R0 | ACTIVE | 58.2 | 61.0 | 6.1 | 3.6 | 2.4 | 2.0 | 1.7 | N/A | 2.2 | 67.8 |