FCBGA dispensing heat sink machine (DS3070)

FCBGA dispensing heat sink machine (DS3070)

The machine features a hot pressing station with 4 zones, CCD in the discharging area for visual detection of heat sink offset, SECS/GEM system, dispensing machine with a position accuracy of 80μm and CCD product direction detection, a 6-head chip placement head for heat sink, optional 2D bar code reading function, and a maximum lamination temperature of 200℃.

  • FCBGA 7×7~120x120mm Carry boat size:(W)137~160x(L)322mm
  • FCBGA/FCCSP
  • FCBGA / FCCSP Flip chip product dispensing and heat sink bonding
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Description

Model DS3050
Product Size FCBGA 7×7~120x120mm Carry boat size:(W)137~160x(L)322mm
Product Category FCBGA/FCCSP
Scope of Application FCBGA / FCCSP Flip chip product dispensing and heat sink bonding

  • The machine has two dispensing valve systems
  • The dispensing machine accuracy is 3mg±5%
  • The dispensing machine mechanism has a repeatability accuracy of ±20μm
  • The dispensing machine has a Laser height measurement function
  • The heat sink chip placement head has pressure detection (1kg- 3kg )
  • Heat sink module CCD automatically aligns and corrects the placement accuracy of 80μm
  • Optional heat sink tray feeding system