DS3070 – FCBGA Lid Attack Machine
DS3070
Package Size: FCBGA 7x7mm ~ 120x120mm
Carry boat size: (W)137mm ~ 160mmx(L)322mm
Product Type: FCBGA / FCCSP
Application: FCBGA / FCCSP flip-chip product dispensing and lid attach
The DS3070 FCBGA Lid Attack Machine is a precision-engineered system designed for the automated removal of lids from FCBGA (Flip Chip Ball Grid Array) packages. This equipment supports high accuracy delidding processes critical to semiconductor failure analysis, reliability testing, and quality assurance. With programmable force control, advanced alignment mechanisms, and support for various package sizes, the DS3070 ensures clean, damage-free lid detachment, improving both throughput and analysis consistency in packaging and R&D environments.
♦ The machine has two dispensing valve systems
♦ Dispensing machine accuracy 3mg±5%
♦ The position accuracy of the sidpenser is 80μm
♦ Repeat accuracy of dispenser mechanism ±20μm
♦ Dispensing machine has CCD product direction orientation
♦ The dispenser has the function of laser height measurement
♦ Lid attach with 6 heads
♦ Lid attach head has pressure detection (1kg-5kg)
♦ Lid attach has CCD to detect dispensing quality
♦ Lid attach CCD automatic alignment correction chip placement accuracy 80μm
♦ Optional radiator tray feeding system
♦ Can be used with 2D Barcode reading function
♦ Snap cure station 4 zone heat press
♦ Compression temperature up to 200℃
♦ CCD in the discharge area visually detects whether the lid attach is offset
♦ The machine has SECS/GEM System
♦ The machine can cooperate with the connection of indium process or graphene process.