IP2000

IP2000

The machine functions include a Laser height measurement function for the dispensing machine, pressure detection (1kg-3kg) for the heat sink chip placement head, automatic alignment and correction of placement accuracy (80μm) by the heat sink module CCD, and an optional heat sink tray feeding system.

  • FCBGA 7×7~120x120mm
  • FCBGA/FCCSP
  • FCBGA / FCCSP Flip chip product dispensing and heat sink bonding
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Description

Model IP1000
Product Size FCBGA 7×7~120x120mm
Product Category FCBGA/FCCSP
Scope of Application FCBGA / FCCSP Flip chip product dispensing and heat sink bonding

  • The machine has two dispensing valve systems
  • The dispensing machine accuracy is 3mg±5%
  • The dispensing machine mechanism has a repeatability accuracy of ±20μm