Description
| Package Type | BGA, LGA, POP etc. |
| Available Pitch | 0.2P~ |
| Characteristics | – Long life span. – Low Cres, Low Contact force (Multi-PARA) – High Speed, Low Powder, High Voltage Test Solution – No Ball Damage – Available For ESD |
Memory Test Socket
Memory Test Socket
Provides optimized solution for all memory device/PKG and different test environments, from the smallest pitch ~ normal pitch (0.2P~1.0P).
