Probe Head

Probe Head

The optimized Wafer Probing Solution with the combination of high technology POGO probe and ultra-precision processing plate is provided. High Performance MEMS Probe Head applied with the MEMS process can respond to customized solutions for each customer with excellent contact characteristics of Low Force, High CCC, and high-strength material.

Specifications

POGO Probe Head MEMS Probe Head
Package Type Wafer (WLCSP) Wafer (SOC)
Available Pitch 120um~ 80um~
Characteristics
  • RF type, Signal length
    2.0mm
  • Solder Bump
  • Wafer Probing &
    Single Die TEST
  • High CCC > 1A
  • Copper Pillar (Flat type)
  • Wire Bond Pad
    (Point Type)
Categories: , , ,

Description

Product Series

workbench
Package Type : Solder Bump
Pitch : 120um
Characteristics :
  • Signal Path <2mm
  • 8site 1skip
workbench
Package Type : Wire-bond Pad
Pitch : 80um
Characteristics :
  • MEMS Point Tip (Rh)
  • Stable Contact
workbench
Package Type : Copper Pillar
Pitch : 80um
Characteristics :
  • High CCC > 1A
  • Low Force Contact