Probe Head

Probe Head

Provides optimized wafer probing solution through the combination of high technology POGO probe and ultraprecision processing plate. High-performance MEMS probe head, applied with MEMS process, is capable of customized solution response by customer through low force, high CCC, and outstanding contact characteristics of high-strength material.

Description

POGO Probe Head MEMS Probe Head
Package Type Wafer (WLCSP) Wafer (SOC)
Available Pitch 120um~ 80um~
Characteristics – RF type, Signal length 2.0mm
– Solder Bump
– Wafer Probing & Single Die TEST
– High CCC > 1A
– Copper Pillar (Flat type)
– Wire Bond Pad (Point Type)