Description
POGO Probe Head | MEMS Probe Head | |
Package Type | Wafer (WLCSP) | Wafer (SOC) |
Available Pitch | 120um~ | 80um~ |
Characteristics | – RF type, Signal length 2.0mm – Solder Bump – Wafer Probing & Single Die TEST |
– High CCC > 1A – Copper Pillar (Flat type) – Wire Bond Pad (Point Type) |