WAFER collapse inspection machine (WR1000)

WAFER collapse inspection machine (WR1000)

The machine functions include offline inspection and modification capabilities, barcode opening corresponding to map file inspection, and being equipped with a 12-inch to 8-inch wafer ring work fixture.

  • Internal crack detection of cutting channel products after wafer cutting
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Description

Model WAFER collapse inspection machine (WR1000)
Scope of Application Internal crack detection of cutting channel products after wafer cutting

  • The machine uses water mirror detection
  • The machine detects FOV 1.6×1.2mm, single pixel 2.5μm
  • Uses infrared optical system with 10 magnification objective lens for detection