LC6300 – Flip Chip Die Bond Offset Inspection
LC6300
Package Size: 7×7 ~ 110mmx110mm
Carry Boat: 137mmx322mm ~ 160mmx320mm
Product Type: FCBGA / FCCSP Products
Applications: After Flip Chip Die Bonding
The LC6300 is a high-accuracy inspection system designed to detect die bond offset in flip chip semiconductor packages. Engineered for advanced semiconductor manufacturing, it ensures precise die alignment, enhances process control, and reduces bonding defects. The LC6300 supports high-throughput lines while maintaining strict quality standards for modern IC packaging.
♦ CCD 25M detection system FOV 60x60mm single pixel 12μm
♦ Die Bond offset detection accuracy +/- 5μm
♦ Die Crack detection accuracy 14μm
♦ Die Chipping detection accuracy 45μm
♦ With Component presence, absence, and offset detection functions
♦ With marking detection function
♦ SECS/GEM system
♦ 2D Bar Code reading function