FI7700 – Full Function 3D Inspection
FI7700
Package Size: 3×3~50x50mm
Package Type: FCBGA/ BGA/ SIP/ QFN/ TSOP/ QFP
Application: JEDEC Tray Feeding Products
The FI7700 is a cutting-edge 3D inspection system designed for high-precision analysis in electronics, automotive, and general manufacturing. It delivers detailed, real-time 3D measurements to detect defects, verify dimensions, and ensure quality across complex components and assemblies. With its advanced scanning technology and robust software, the FI7700 enhances production reliability and speeds up quality control processes.
♦ Product stack detection.
♦ Total height detection function (QFN, BGA, QFP)
♦ Auto re-inspection function for defective products
♦ Marking automatic teaching and reading function
♦ Automatic light source correction and compensation
♦ AI automatic review system function
♦ Equipped with 3 brands of 14 nozzles in each row (42 pcs)
♦ 5S side detection function
♦ 2D and 5S FOV 60x60mm accuracy 9μm
♦ 3D FOV 60x60mm accuracy 16μm
♦ 2D：Lead, Pad, Ball, PVI, Marking, 2D code
♦ 3D：component, warpage, coplanarity
♦ Total height：QFN, BGA, QFP