Special Pin

Pyramid Pin

Pyramid PIN manufactured by applying the MEMS process to the Dut Side Of Contact part can respond to customized solutions for each customer with excellence in wear resistance with high hardness (Hv1000) and contact characteristics with sharp contact tip.

Specifications

POGO Probe Head MEMS Probe Head
Package Type Wafer (WLCSP) Wafer (SOC)
Available Pitch 120um~ 80um~
Characteristics
  • RF type, Signal length
    2.0mm
  • Solder Bump
  • Wafer Probing &
    Single Die TEST
  • High CCC > 1A
  • Copper Pillar (Flat type)
  • Wire Bond Pad
    (Point Type)
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Description

Battery Pin

Based on the best technology and know-how, solution suitable for testing the charging and discharging of Lithium-Polymer Battery is provided.

Specifications

POGO Probe Head MEMS Probe Head
Package Type Wafer (WLCSP) Wafer (SOC)
Available Pitch 120um~ 80um~
Characteristics
  • RF type, Signal length
    2.0mm
  • Solder Bump
  • Wafer Probing &
    Single Die TEST
  • High CCC > 1A
  • Copper Pillar (Flat type)
  • Wire Bond Pad
    (Point Type)

Product Series

Package Type : QFP
Pitch : 0.4P
Characteristics :
  • Long life span
  • Increased reliability of test
  • Reduction of maintenance
  • Reduction of re-test operation
Current : 15A
Characteristics : Sleeve Type
Package Type : BGA
Pitch : 0.35P~
Characteristics :
  • Long life span
  • Increased reliability of test
  • Reduction of maintenance
  • Reduction of re-test operation
Package Type : LGA
Pitch : 0.35P~
Characteristics :
  • Long life span
  • Increased reliability of test
  • Reduction of maintenance
  • Reduction of re-test operation
Package Type : QFN
Pitch : 0.35P~
Characteristics :
  • Long life span
  • Increased reliability of test
  • Reduction of maintenance
  • Reduction of re-test operation