Full Function 3D Inspection ( FI7700 )
FI7700
Package Size: 3×3~50x50mm
Package Type: FCBGA/ BGA/ SIP/ QFN/ TSOP/ QFP
Application: JEDEC Tray Feeding Products
♦ Product stack detection.
♦ Total height detection function (QFN, BGA, QFP)
♦ Auto re-inspection function for defective products
♦ Marking automatic teaching and reading function
♦ Automatic light source correction and compensation
♦ AI automatic review system function
♦ Equipped with 3 brands of 14 nozzles in each row (42 pcs)
♦ 5S side detection function
♦ 2D and 5S FOV 60x60mm accuracy 9μm
♦ 3D FOV 60x60mm accuracy 16μm
♦ 2D：Lead, Pad, Ball, PVI, Marking, 2D code
♦ 3D：component, warpage, coplanarity
♦ Total height：QFN, BGA, QFP