Power Device Test

The front-end test is mainly used in the wafer processing to check whether the processing parameters of the wafer products meet the design requirements or there are defects affecting the yield after each step of the manufacturing process. The back-end test equipment is mainly used after wafer processing to check whether the performance of the chip meets the requirements, which belongs to the electrical performance test. Semight provides solutions such as Wafer Level Burn In system and Known Good Die handler for SiC testing, offering the value to customer in test efficiency improvement and test cost reduction.