Wafer Level Burn-In

The Wafer Level Burn-In System is designed for HTGB and HTRB burn-in testing of SiC/GaN wafers. Designed for automotive-grade applications, it effectively identifies infant mortality in dies before module packaging, enhancing product dependability. Widely adopted across R&D, production, and quality control, the WLBI system ensures SiC modules consistently meet stringent automotive reliability standards, delivering robust and reliable performance throughout their lifecycle.