PLR0010
Package Level Reliability Test Equipment
The Semight PLR0010 package-level reliability test equipment is a reliability test system developed based on the JEDEC reliability test standards. It is mainly used for testing functions such as TDDB (Time-Dependent Dielectric Breakdown), HCI (Hot Carrier Injection), NBTI (Negative Bias Temperature Instability), and EM (Electromigration). The test system can reach temperatures up to 250℃ and utilizes algorithm models to analyze data, enabling the analysis of process defects. Each channel of the system is equipped with independent overcurrent protection to ensure the safety of the devices under test (DUT). Additionally, it can interface with the customer’s EAP system for production data management, facilitating in-depth performance analysis and quality control.
Multiple Test Modes
TDDB/HCI/BTI/GOI
Micro Oven Architecture
4 independent ovens
High Temperature Testing
Up to 250°C
Temperature uniformity of ±1%°C
High Parallel Testing
Simultaneous testing of 960 DUTs
Supports On-the-fly
Switch to monitor ＜ 220 μs
Self-developed SMU
Autorange make sure high accuracy
Flexible API Interfaces
Flexible API and easy to use
| Parameter | Description |
| Temperature Range | Room～250℃ |
| DUTs | 960 (Parallel) |
| Oven | 4 independent ovens |
| Operating Altitude | 0~2000m |
| EMC | Comply to EU EMC Standards |
| Software System | Windows LTSC |
| Programming | C#/C++ |
| Software Features | Test task editing and settings, data display and data analysis, MES interface, user permission control, calibration and maintenance, fault diagnosis |