AL6200
AL6200
Die Inspection Sorting System
Semight AL6200 Die Sorting system is mainly used in power chip die level visual inspection and sorting. The sorting condition is according to the different test specification and visual inspection. AL6200 supports up to 8pcs different classifications, and finish the six sides visual inspection before the sorting. The system supports frame ring input and tape reel output (tray is optional).
Features
Automatic Expansion
Allows for automatic expansion of UV/blue tape frames, enabling normal production of non-expansion frames
Code Scanning
Scan QR codes/barcodes to accurately record wafer information, including Lot ID, wafer ID, and tape ID
Data Map Function
Provides visual access to comprehensive mapping information
Rotational Feeding System
Enable 360° rotation of wafers as required
Tape Width
Supports a wide range of tape widths, ranging from 8 mm to 24 mm (typically 12 mm)
UPH Capability
Achieves a minimum throughput of 2,000 units per hour (UPH)
Six-side Chip Inspection
Supports thorough chip inspection on all six sides, with a maximum defect accuracy of 10 μm
Powerful Software
Facilitates single-chip traceability, seamless data upload, MES integration, and multi-account management with three-level rights control
System Function
| Parameter | Index |
| Applicable Product | SiC, IGBT chip |
| Wafer Size | 6” & 8” |
| AOI Function | Six sides |
| Input Mode | Frame ring |
| Output Mode | Tape reel, Tray |
| Sealing Mode | Heat seal |
| Nitrogen Protection | >0.6 MPa |
| Equipment Power | 4.5 kW |
| Dimension (mm) | 2885 × 2100 × 1850 |
| SECS/GEM Protocol | Support |
General Indicators and Software
| Parameter | Index |
| Operating Temperature | 15-30 ℃ |
| Storage Temperatur | -10-50 ℃ |
| Working Humidity | 40-70% |
| Storage Humidity | <90% |
| Working Altitude | 0-2 km |
| Power Supply | 200-240 VAC，30 A，50 Hz |
| Air Supply Pressure | ＞0.6 Mpa |
| Software System | VisualStudio2019 |
| Software Language Environment | C#（.Net Frame Work 4.7.2） |
| Software Function | Test plan editing, test condition and parameter Spec setting, chip description, MES interface, test data management and analysis, calibration maintenance, fault diagnosis |