CT8201

Highly integrated and fully automated solution covering very complex testing processes

Improve efficiency and reduce potential risks of human involvement
Automatic switching of collimated fibers and large area photodetectors
Automatic sorting of DUTs after testing

All mechanical parts can be returned to the factory independently

Automatic alarm status and prompt display
All instruments, test plans, pass/fail criteria are easily configurable

This module consists of thimble Z module, X/Y motion module, and blue film rotation module 4 sub-function modules. Pickup function. Compatibility mode of Chip package: 1 x 6-inch chip expansion ring.

• Integrated module with a hollow rotating platform, dual 3-axis chip calibration modules, and a 3-axis light detection module.
• Built-in ID and position recognition camera for accurate chip alignment and positioning.
• Automatic position and angle calibration after loading, followed by chip power-on testing.
• PD/Collimator function supports fast switching via a dedicated motion axis for improved testing efficiency.
• Independent test bench temperature control with stability of ±0.2°C for consistent and reliable test results.

• Integrated loading camera and module for automatic chip recognition, supporting different incoming material configurations.
• High/normal temperature test camera with a 3-axis motion module for precise chip position calibration after loading.
• Automatic chip ID recognition during the high-temperature testing process.
• Probe power-on adjustment module supports up to 3 probe sets for flexible test configurations.
• Optional backlight PD sub-module for expanded testing capabilities.
• Supports LIV, extinction ratio, and other key parameter testing for DFB and EML laser devices.

The blanking module is equipped with 4 tray placement areas, which can support 4,6-inch blue films, Or customize compatible unloading carriers according to customer needs.