CT8203
CT8203
LT Die Tester
Die Tester CT8203 is for the LIV scanning and optoelectronic characteristics test of the LD laser at low temperature and normal temperature. The system is designed with a dual temperature zone to test two DUTs under different temperatures in parallel. The system is mainly composed of six parts: wafer supply area, chip handling area, chip position correction area, chip OCR extraction area, chip testing area, and chip storage area. The system integrates wafer ring loading, transportation, DUT ID scanning, high/low temperature testing, unloading and sorting.
CT8203 supports laser forward/backward photoelectric test and forward light spectrum test. It supports two temperature zone tests: two test platforms to support low temperature/normal temperature parallel test.
CT8203′ test efficiency is very high, and the above 6 processes can be completed within 6.5s (1 LIV + 3 spectra). Ideal for high volume production applications. The system adopts eccentric cam structure, high-precision linear motor, high-repeatability stepper motor gauge, high-precision fixture, high-stability power-on probe and high-thermal-conductivity stage, making it ultra-high precision and stability.
Features
Fully Automated & Intelligent Integrated Solutions
Highly integrated and fully automated solution covering very complex testing processes
High Efficiency
Improve efficiency and reduce potential risks of human involvement
Automatic switching of collimated fibers and large area photodetectors
Automatic sorting of DUTs after testing
Maintenance and Upgrades are Very Simple
All mechanical parts can be returned to the factory independently
Easy to Use
Automatic alarm status and prompt display,
All instruments, test plans, pass/fail criteria are easily configurable
Functions and Advantages
Fully Automated &
Intelligent Integrated Solutions
Loading Module
- This module consists of thimble Z module, X/Y motion module, and blue film rotation module 4 sub-function modules. Pickup function.
- Compatibility mode of Chip packaging: 1 x 6-inch chip expansion ring.
High/low Temperature Test Module
- Linear motion module for precise 3-DOF (X, Y, θ) chip alignment and calibration.
- Integrated 3-axis light detection module for accurate optical measurement.
- Built-in ID and position recognition camera for automatic chip identification and alignment.
- Probe power-on adjustment module enables automatic position calibration and chip power-on testing.
- PD/Collimator function supports fast switching through a dedicated motion axis.
- Independent test bench temperature control with < ±0.2°C stability for highly accurate and reliable testing.
Camera, Probe Power-on Module
- Integrated feeding camera and module for automatic chip recognition, configurable for different incoming material requirements.
- 3-axis motion module performs precise chip position calibration through multi-image alignment.
- Automatic chip ID recognition during the calibration process.
- Probe power-on module supports up to 3 probe sets for flexible testing configurations.
- Optional backlight PD module for expanded optical testing capabilities.
- Supports LIV, EA, spectral, and other photoelectric tests for DFB, EML, and EML+SOA laser devices.
Bin Sorting Module
The bin sorting module is equipped with 4 carrier tray placement areas for up to 4 X 6-inch blue tapes, or customize compatible blanking carriers.
| Items | Specification | |
| System Functions | DUT Type | Compatible with customer-specified DFB, EML and EML+SOA Die tests (according to the difference in cavity length and size between DFB and EML, the test stage can be selected to be compatible or incompatible) |
| Test items | Laser front light and backlight LIV, EML extinction ratio and spectral test | |
| Test seat | 2 | |
| ID identification | Support Chip ID identification | |
| Chip size | L&W≥150 μm, H≥80~150 μm | |
| Nozzle structure | Specially designed suction nozzle structure, first peeled from the material box, and then sucked up | |
| Test Parameters | Ith, Se, Iop, Pf, Vf,I r, PKink, Ikink, Rd, Pmax, IRoll, ER, λc, SMSR and other nearly 100 parameters,Support any requirements customer need | |
| Loading Container | 1 X 6-inch blue tape | |
| Unloading Container | 4 X 6-inch blue tapes | |
| Blanking and Grading | The materials are classified according to the identification and test results, and the material classification conditions can be edited in the software according to customer requirements | |
| CDA Requirements | >600L/Min（If less than this flow will affect the dew point speed） | |
| Electrical | Source Meter Unit Type | Semight self-developed SMU or other specified types |
| Number of SMU | 3 dual-channel source meters for DFB lasers, 4 dual-channel source meters for EML lasers, and 5 dual-channel source meters for EML+SOA lasers | |
| Power Up Type | Support CW and Pulse power up | |
| DC current | 3A, 1A, 100mA, 10mA, 1mA, 100μA | |
| Minimum Power Resolution | 20μA, 5μA, 500nA, 50nA, 5nA, 500pA | |
| Minimum Measurement Accuracy | 0.03%+50 nA | |
| DC Voltage Source Range | 30V, 10V, 1V | |
| Voltage Resolution | 100μV, 10μV, 1μV | |
| Minimum Voltage Measurement Accuracy | 0.02%+1 mV | |
| Minimum Pulse Width | 250 μs | |
| Normal Operation Undershoot | NO EOS | |
| Normal Operation Undershoot | NO EOS | |
| Normal Operation Undershoot | NO EOS | |
| Abnormal Operation Overshoot | NO EOS | |
| Optical | Detector type | Ge |
| Optical Power Detection Wavelength Range | 800-1700 nm | |
| Optical Power Measurement Range | 10 μW-25 mW(>25 mW Attenuator required) | |
| Spectral Test Wavelength Range | Customer supplied spectrometer or Yokogawa AQ6360 | |
| Spectral Test Accuracy | Customer supplied spectrometer or Yokogawa AQ6360 | |
| EA DCER precision | ±0.2 dB | |
| Temperature | Temperature Control Method | TEC+water cooling (with dew point monitoring, the dew point can be within -70 ℃) |
| Temperature Range | -40~95 ℃ | |
| Temperature Rise Rate | Room temperature rises to 90 ℃ < 5 minutes | |
| Temperature Drop Rate | Room temperature dropped to -40 ℃ <10 minutes | |
| Temperature Accuracy | ±0.5 ℃ | |
| Temperature Stability | ±0.2 ℃ | |
| Overall Performance |
Ith Repeatability | ±1% |
| Power Repeatability | ±2% | |
| Wavelength Repeatability | <±0.2 nm | |
| SMSR Repeatability | <3 dB | |
| ID Identification One-time Success Rate | >99.5% | |
| UPH | <6.5s (including 1 LIV, 3 spectral scans) | |
| Current Pulse Width | Supports minimum 1μs pulse width (using Semight S3026P SMU) |