Dynamic Temperature Forcing System
CTS0303M, CTS0303C ,CTS0303D, CTS0437
Dynamic Temperature Forcing System is designed for precise temperature control of low to high-power devices, enabling rapid temperature transitions across a wide operating range of lowest to -55°C and up to 150°C. With exceptional cooling and heating capacity, ensuring accurate thermal management for various IC package types. Optimized for Tcase and Tjmax testing, it seamlessly integrates with bench handlers for automated testing, making it an ideal solution for demanding test environments.
Dynamic Temperature
Forcing System
Advanced Temperature and Force Testing for Semiconductor Validation
Controlled temperature and contact force for reliable evaluation of device under test (DUT) across varying thermal conditions. Designed for semiconductor testing, the system supports device validation and temperature characterization through consistent thermal contact.
Dynamic Temperature
Forcing System
Advanced Temperature and Force Testing for Semiconductor Validation
Controlled temperature and contact force for reliable evaluation of device under test (DUT) across varying thermal conditions. Designed for semiconductor testing, the system supports device validation and temperature characterization through consistent thermal contact.
Water Block
-55°C MinHeater Pad
150°C MaxPedestal
2000N MaxDUT
3x3 to 70x70mmFirst of Kind (FoK)
In Thermal, Force Control & MonitoringAdvancing Testing from IC Design Lab to Semiconductor Production
(FoK)
First of Kind
In Thermal, Force Control & MonitoringAdvancing Testing from IC Design Lab to Semiconductor Production
Confidence Through Every Test
Advanced temperature and force control with real-time monitoring delivers consistent test conditions for high-performance semiconductor validation
Confidence Through Every Test
Advanced temperature and force control with real-time monitoring delivers consistent test conditions for high-performance semiconductor validation
Why Choose Us?Precision, Flexibility and Sustainability in Every Test
Dynamic Force Control
Dynamic control over contact force maintains consistent DUT contact for stable, repeatable thermal testing
Universal
Versatile thermal head configurations simplify testing across different device packages and setups
Real-Time Monitoring
Live temperature and force readings help detect deviations during testing for timely adjustments
Scalability
Expandable setups support growing demands from device validation to production testing
Cost Efficiency
Configurations based on actual testing needs help control upfront investment and ongoing operating costs
Why Choose Us?Precision, Flexibility and Sustainability in Every Test
Dynamic Force Control
Dynamic control over contact force maintains consistent DUT contact for stable, repeatable thermal testing
Universal
Versatile thermal head configurations simplify testing across different device packages and setups
Real-Time Monitoring
Live temperature and force readings help detect deviations during testing for timely adjustments
Scalability
Expandable setups support growing demands from device validation to production testing
Cost Efficiency
Configurations based on actual testing needs help control upfront investment and ongoing operating costs
Dynamic mUCV delivers precise temperature and force control for semiconductor testing
Ready for Your Test Environment
From standalone evaluation to integrated handling, configurable setups support different device packages, testing workflows and production requirements
Ready for Your Test Environment
From standalone evaluation to integrated handling, configurable setups support different device packages, testing workflows and production requirements
Dynamic mUCV delivers precise temperature and force control for semiconductor testing
Configured for Your Test Requirements
Match your test requirements with advanced features and high performance for confidence in every test
Automated Dynamic mUCV
Temperature and force control with benchtop handling CTS0437
Dynamic mUCV
For characterization board testing CTS0303M
mUCV
For characterization board testing CTS0303C
mUDV
For development vehicle board testing CTS0303D
Automated Dynamic mUCV
Temperature and force control with benchtop handling CTS0437
Package Contents
- Benchtop handler
- Dynamic mUCV
- CTS chiller
- Thermal controller with I/O
Dynamic mUCV
For characterization board testing CTS0303M
Package Contents
- Chiller module — 1 unit
- Thermal head with TECs — 1 unit
- Thermal controller with PSU and chassis — 1 unit
mUCV
For characterization board testing CTS0303C
Package Contents
- Chiller module — 1 unit
- Thermal head with TECs — 1 unit
- Thermal controller with PSU and chassis — 1 unit
mUDV
For development vehicle board testing CTS0303D
Package Contents
- Chiller module — 1 unit
- Thermal heads with TECs and six screw design — supports up to 2 units
- Thermal controllers with PSU and chassis — supports up to 2 units
Configured for Your Test Requirements
Match your test requirements with advanced features and high performance for confidence in every test
Automated Dynamic mUCV
Temperature and force control with benchtop handling CTS0437
Dynamic mUCV
For characterization board testing CTS0303M
mUCV
For characterization board testing CTS0303C
mUDV
For development vehicle board testing CTS0303D
Automated Dynamic mUCV
Temperature and force control with benchtop handling CTS0437
Package Contents
- Benchtop handler
- Dynamic mUCV
- CTS chiller
- Thermal controller with I/O
Dynamic mUCV
For characterization board testing CTS0303M
Package Contents
- Chiller module — 1 unit
- Thermal head with TECs — 1 unit
- Thermal controller with PSU and chassis — 1 unit
mUCV
For characterization board testing CTS0303C
Package Contents
- Chiller module — 1 unit
- Thermal head with TECs — 1 unit
- Thermal controller with PSU and chassis — 1 unit
mUDV
For development vehicle board testing CTS0303D
Package Contents
- Chiller module — 1 unit
- Thermal heads with TECs and six screw design — supports up to 2 units
- Thermal controllers with PSU and chassis — supports up to 2 units
Extreme Performance for Thermal Testing
Ultra performance temperature and force control for demanding semiconductor testing and validation
Lowest
-55°C
Extreme Low temperatures achieved
with thermo chillers.
Up to
150°C
Controlled heating for high temperature
device validation.
| Specifications | ||
|---|---|---|
| Temperature Range | -55°C to 150°C Accuracy: 2°C with no load (T/C Accuracy is 1°C) Stability: 1°C under controlled conditions Tolerance: ± 3°C at steady state |
|
| Temperature | Ramp rate heating: >0.85°C/sec | |
| Transition Rates |
Ramp rate cooling: >0.60°C/sec | |
| Contact Force |
100kg (max) | |
| DUT Dimensions |
3x3mm to 70x70mm | |
| Communication | USB / RS232 / RS485 | |
| Dimension & Weight | ||
|---|---|---|
| Thermal Head | L125mm x W72mm x H30mm / 7kg | |
| Thermal Controller | L400mm x W130mm x H185mm / 10kg | |
| Chiller | L450mm x W700mm x H690mm / 110kg | |
| System Requirements | ||
|---|---|---|
| System Protection | – Over-Voltage / Over-Current / Surge Protection – Over-Temperature Protection – Electric Leakage Protection |
|
| Power Requirements | 220V, 50Hz, Single Phase 110V*, 60Hz (Optional) |
|
| Operating Temperature | 22°C -30°C | |
Lowest
-55°C
Extreme Low temperatures achieved
with thermo chillers.
Up to
150°C
Controlled heating for high temperature
device validation.
| Specifications | ||
|---|---|---|
| Temperature Range | -55°C to 150°C Accuracy: 2°C with no load (T/C Accuracy is 1°C) Stability: 1°C under controlled conditions Tolerance: ± 3°C at steady state |
|
| Temperature | Ramp rate heating: >0.85°C/sec | |
| Transition Rates |
Ramp rate cooling: >0.60°C/sec | |
| Contact Force |
100kg (max) | |
| DUT Dimensions |
3x3mm to 70x70mm | |
| Communication | USB / RS232 / RS485 | |
| Dimension & Weight | ||
|---|---|---|
| Thermal Head | L125mm x W72mm x H30mm / 7kg | |
| Thermal Controller | L400mm x W130mm x H185mm / 10kg | |
| Chiller | L450mm x W700mm x H690mm / 110kg | |
| System Requirements | ||
|---|---|---|
| System Protection | – Over-Voltage / Over-Current / Surge Protection – Over-Temperature Protection – Electric Leakage Protection |
|
| Power Requirements | 220V, 50Hz, Single Phase 110V*, 60Hz (Optional) |
|
| Operating Temperature | 22°C -30°C | |
Thermo Chillers for Extreme 55
Compressor cooling with PID control for consistent performance under extreme thermal conditions
System Overview
ArcticFlow
Water Cooled Thermo Chiller
−72°C to −53°C
300W cooling capacity at −72°C
±1°C temperature stability
AeroFlow
Air Cooled Thermo Chiller
−72°C to −53°C
300W cooling capacity at −72°C
±1°C temperature stability
Air Cooled
CTS0808-ASY0500-00
| Specifications | |
|---|---|
| Dimension & Weight | L850mm × W600mm × H550mm; 320kg |
| Cooling Capacity | 300W @ −72°C |
| Temperature Control | PID |
| Cooling Mode | Compressor Cooling |
| Refrigerant | R404a, R508b |
| Size of Connector | ZG1-2 Female Thread |
| Temperature Range | −72°C to −53°C |
| Temperature Stability | ±1°C |
| Power Consumption | −55°C, 200–300W load: 1.2kW |
| Rated Current | 25A Total (16A Chiller / 9A Heating) |
| Power Requirements | 230V, 50Hz, Single Phase |
| Plug Provided | IEC 60309 Plug, 32A |
| Communication Port | Modbus, TCP, RJ-45 |
Water Cooled
CTS0808-ASY0300-00
| Specifications | |
|---|---|
| Dimension & Weight | L850mm × W552mm × H600mm; 150kg |
| Cooling Capacity | 300W @ −72°C |
| Temperature Control | PID |
| Cooling Mode | Compressor Cooling |
| Refrigerant | R404a, R508b |
| Size of Connector | ZG1-2 Female Thread |
| Temperature Range | −72°C to −53°C |
| Temperature Stability | ±1°C |
| Power Consumption | −55°C, 200–300W load: 1.2kW |
| Rated Current | 21A Total (12A Chiller / 9A Heating) |
| Power Requirements | 230V, 50Hz, Single Phase |
| Plug Provided | IEC 60309 Plug, 32A |
| Communication Port | Modbus, TCP, RJ-45 |
Thermo Chillers for Extreme 55
Compressor cooling with PID control for consistent performance under extreme thermal conditions
System Overview
ArcticFlow
Water Cooled Thermo Chiller
−72°C to −53°C
300W cooling capacity at −72°C
±1°C temperature stability
AeroFlow
Air Cooled Thermo Chiller
−72°C to −53°C
300W cooling capacity at −72°C
±1°C temperature stability
Air Cooled
CTS0808-ASY0500-00
| Specifications | |
|---|---|
| Dimension & Weight | L850mm × W600mm × H550mm; 320kg |
| Cooling Capacity | 300W @ −72°C |
| Temperature Control | PID |
| Cooling Mode | Compressor Cooling |
| Refrigerant | R404a, R508b |
| Size of Connector | ZG1-2 Female Thread |
| Temperature Range | −72°C to −53°C |
| Temperature Stability | ±1°C |
| Power Consumption | −55°C, 200–300W load: 1.2kW |
| Rated Current | 25A Total (16A Chiller / 9A Heating) |
| Power Requirements | 230V, 50Hz, Single Phase |
| Plug Provided | IEC 60309 Plug, 32A |
| Communication Port | Modbus, TCP, RJ-45 |
Water Cooled
CTS0808-ASY0300-00
| Specifications | |
|---|---|
| Dimension & Weight | L850mm × W552mm × H600mm; 150kg |
| Cooling Capacity | 300W @ −72°C |
| Temperature Control | PID |
| Cooling Mode | Compressor Cooling |
| Refrigerant | R404a, R508b |
| Size of Connector | ZG1-2 Female Thread |
| Temperature Range | −72°C to −53°C |
| Temperature Stability | ±1°C |
| Power Consumption | −55°C, 200–300W load: 1.2kW |
| Rated Current | 21A Total (12A Chiller / 9A Heating) |
| Power Requirements | 230V, 50Hz, Single Phase |
| Plug Provided | IEC 60309 Plug, 32A |
| Communication Port | Modbus, TCP, RJ-45 |
Core Innovation for Device Validation
Advanced temperature and force control for consistent semiconductor characterization and testing
Lowest
-40°C
Dynamic Low temperatures achieved
with CTS chiller.
Up to
150°C
Controlled heating for high temperature
device validation.
| Specifications | ||
|---|---|---|
| Temperature Range | -40°C to 150°C Accuracy: 2°C with no load (T/C Accuracy is 1°C) Stability: 1°C under controlled conditions Tolerance: ± 3°C at steady state |
|
| Temperature | Ramp rate heating: >0.85°C/sec | |
| Transition Rates |
Ramp rate cooling: >0.60°C/sec | |
| Contact Force |
100kg (max) | |
| DUT Dimensions |
3x3mm to 70x70mm | |
| Communication | USB / RS232 / RS485 | |
| Dimension & Weight | ||
|---|---|---|
| Thermal Head | L125mm x W72mm x H30mm / 7kg | |
| Thermal Controller | L400mm x W130mm x H185mm / 10kg | |
| Chiller | L450mm x W700mm x H690mm / 110kg | |
| System Requirements | ||
|---|---|---|
| System Protection | – Over-Voltage / Over-Current / Surge Protection – Over-Temperature Protection – Electric Leakage Protection |
|
| Power Requirements | 220V, 50Hz, Single Phase 110V*, 60Hz (Optional) |
|
| Operating Temperature | 22°C -30°C | |
Lowest
-40°C
Dynamic Low temperatures achieved
with CTS chiller.
Up to
150°C
Controlled heating for high temperature
device validation.
| Specifications | ||
|---|---|---|
| Temperature Range | -40°C to 150°C Accuracy: 2°C with no load (T/C Accuracy is 1°C) Stability: 1°C under controlled conditions Tolerance: ± 3°C at steady state |
|
| Temperature | Ramp rate heating: >0.85°C/sec | |
| Transition Rates |
Ramp rate cooling: >0.60°C/sec | |
| Contact Force |
100kg (max) | |
| DUT Dimensions |
3x3mm to 70x70mm | |
| Communication | USB / RS232 / RS485 | |
| Dimension & Weight | ||
|---|---|---|
| Thermal Head | L125mm x W72mm x H30mm / 7kg | |
| Thermal Controller | L400mm x W130mm x H185mm / 10kg | |
| Chiller | L450mm x W700mm x H690mm / 110kg | |
| System Requirements | ||
|---|---|---|
| System Protection | – Over-Voltage / Over-Current / Surge Protection – Over-Temperature Protection – Electric Leakage Protection |
|
| Power Requirements | 220V, 50Hz, Single Phase 110V*, 60Hz (Optional) |
|
| Operating Temperature | 22°C -30°C | |
CTS Chiller for Dynamic 40
Compressor cooling with intelligent PID control, high stability and a compact under table design
System Overview
mUCV / mUDV Flowchart
PID Control
CTS Chiller
Chiller for Dynamic 40
mUCV
mUDV
CTS Chiller
Compressor cooling with intelligent PID control for Dynamic 40
mUCV
mUDV
| Specifications | |
|---|---|
| Dimension | L875mm x W560mm x H730mm |
| Weight | 110kg |
| Cooling Capacity | 3300W @ 25°C |
| Temperature Control | PID |
| Cooling Mode | Compressor Cooling |
| Refrigerant | R404a |
| Temperature Range | -20°C to 35°C |
| Temperature Stability | ±0.1°C |
| Pump Pressure | 1 ~ 4bar |
| Pump Flow | 20 ~ 50L/min |
| Rated Flow | 30L/min @ 3.2bar |
| S/S Reservoir | 8L |
| Size of Connector | Rp ½ |
| Electrical Requirements | |
|---|---|
| Rated Current | 3900W |
| Power Requirements | 220V, 50Hz, Single Phase 110V*, 60Hz (Optional) |
| Communication Port | RS232 / RS485 |
CTS Chiller for Dynamic 40
Compressor cooling with intelligent PID control, high stability and a compact under table design
System Overview
mUCV / mUDV Flowchart
PID Control
CTS Chiller
Chiller for Dynamic 40
mUCV
mUDV
CTS Chiller
Compressor cooling with intelligent PID control for Dynamic 40
mUCV
mUDV
| Specifications | |
|---|---|
| Dimension | L875mm x W560mm x H730mm |
| Weight | 110kg |
| Cooling Capacity | 3300W @ 25°C |
| Temperature Control | PID |
| Cooling Mode | Compressor Cooling |
| Refrigerant | R404a |
| Temperature Range | -20°C to 35°C |
| Temperature Stability | ±0.1°C |
| Pump Pressure | 1 ~ 4bar |
| Pump Flow | 20 ~ 50L/min |
| Rated Flow | 30L/min @ 3.2bar |
| S/S Reservoir | 8L |
| Size of Connector | Rp ½ |
| Electrical Requirements | |
|---|---|
| Rated Current | 3900W |
| Power Requirements | 220V, 50Hz, Single Phase 110V*, 60Hz (Optional) |
| Communication Port | RS232 / RS485 |
Looking to Configure Your
Testing Setup?
Discuss your temperature, force and integration requirements with our team
Looking to Configure
Your Testing Setup?
Discuss your temperature, force and integration requirements with our team