Package Size: 11×11 ~ 60mmx60mm

Product Type: FCBGA / FCCSP

Application: After under fill open short tester.

The SP1100 high precision open short tester for FCBGA and FCCSP is a cutting-edge testing solution developed for advanced semiconductor packaging applications. Designed to accurately detect open and short circuits, the SP1100 delivers fast, reliable, and highly accurate testing for Flip-Chip Ball Grid Array (FCBGA) and Flip-Chip Chip Scale Package (FCCSP) devices.

With support for fine-pitch, high-density interconnects, the SP1100 ensures unmatched test resolution and consistency. Its robust design, intelligent probing system, and rapid cycle time make it ideal for quality assurance and process control in both high-volume manufacturing and engineering validation environments.

This open short tester is built to meet the rigorous demands of next-generation semiconductor packaging, offering seamless integration with automated handling systems, and support for a wide range of substrates and formats.