PB6400
PB6400
KGD Die Handler
Semight PB6400 KGD Die Handler can be mainly used for power chip Die-level dynamic and static test to implement the screening of chip performance indicators and improve the first pass yield of the module after packaging. The testers in the corresponding specifications can be configured by test items, test conditions and test parameters. According to customer requirements, can supports the customized development. The system supports a variety of chip packaging methods, such as blue tap, Waffle Pack and Tape &Reel.
Excellent Scalability
Modular design with loading
unloading and test stations
Dynamic, Static and UIS Tests
Static test 2000 V/ 200 A
Dynamic test 2000 V/ 1500 A
Multi-site Parallel Testing
Supports up to four independent test sites, each configurable with unique test conditions and parameters
Precision Temperature Control
Room temperature ~ 185 ℃
Accuracy＜±3°C
Resolution: 0.1°C
Airtight Socket Design
Supports nitrogen gas for arcing protection with integrated pressure monitoring
6s AOI
Micro-scale visible defect inspection down to 12 µm
High Throughput
Up to 900 UPH @ 1s test time for Known Good Die
Powerful Software
Supports data MAP and bin sorting
Enables local storage, database uploads, and EAP integration
Offers tiered permissions and multi-account management
| Category | Parameter | Specification | Remark |
| Basic Parameters | Die Size | 3*3mm-8*8mm | |
| Die Thickness | 100-400μm | ||
| P&P Accuracy | ±30μm | ||
| Temperature System | Temperature Range | Room Temperature ~185℃ | |
| Resolution | 0.1℃ | ||
| Tolerance | ≤±3℃ | ||
| Vision Inspection System |
Inspection Accuracy | ≥12μm | Grayscale contrast ratio > 40 |
| Defect | Top/Bottom: Scratch, Dirt, Contamination, Burn Mark, Chipped, Defect |
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| Side: Chipped | |||
| Stability | MTBF | >168H | |
| MTBA | >2H | ||
| MTTA | 5 min | ||
| MTTR | <30 min | ||
| Drop Rate | ≤0.01% | Due to P&P | |
| Fragmentation Rate | ≤0.01% | ||
| Probe Depth | ≤2μm | ||
| Drain Kelvin | ≤2Ω | TiNiAg material | |
| Efficiency | Single Die | ≥500 UPH | Test time ≤1s |
| Dual Die | ≥900 UPH | Test time ≤1s |