PB6800
PB6800
SiC KGD Die Handler
Semight PB6800 is a high-end SiC KGD Die Handler widely used in the power electronics industry, specializing in dynamic and static parameter testing of bare die-level SiC power chips. It adopts a modular design and supports multiple chip feeding methods, including Frame Ring, Tape & Reel, and Tray. The system also supports Hard Docking connection and multi-station room/high-temperature testing, equipped with high-voltage anti-arcing functionality.
Excellent Scalability
Modular design with loading, unloading, and multiple test stations
Six-Channel Parallel Testing
Supports up to 2 temperature zones for testing
Different test stations support varying test conditions and items
Dynamic, Static, and UIS Tests
Static test 2000 V/ 600 A
Dynamic test 1200 V/ 2000 A
Modular Unloading Design
Supports unloading in wafer / wafer + tape & reel / wafer + auto tray configurations
Precise Temperature Control
Range: RT ~ 200°C,
accuracy: ±3°C,
resolution: 0.1°C
Airtight Socket Design
Prevents high-voltage arcing
through nitrogen protection
and air pressure monitoring
Efficient Multi-station
Up to 6 test stations
with a test time of 0.7s
and UPH > 4000
Good Maintainability
Supports automatic socket replacement in case of die failure,
improving equipment uptime
| Category | Parameter | Specification |
| Basic Parameters | Type | SiC, IGBT |
| UPH | Up to 4700, including input and output | |
| Loader | Wafer, Auto Tray, Tape | |
| Unloader | Wafer / Wafer + Auto Tray / Wafer + Tape&Reel | |
| Temperature Control | Temperature Range | Up to 200°C |
| Tolerance | ≤±3°C | |
| Vision Inspection
System |
Station | Up to 6 |
| Stray Inductance | ≤40 nH | |
| Retrofit Kit | Socket | |
| Die Size | 2.5*2.5 mm-8*8 mm | |
| Die Thickness | 100 µm- 400 µm | |
| P&P Accuracy | ±30 µm | |
| Unloader | Wafer / Wafer +Auto Tray / Wafer+Tape&Reel | |
| Socket Replacement | Auto | |
| Socket Cleaning | Auto | |
| AOI | 6 | |
| AOI Accuracy | ≥12 µm | |
| Defect Inspection | Frontside / Backside: Scratches, Stains, Foreign Material, Cracks, Unfilled Corners, and Chipping.
Side: Edge Chipping |
|
| Stability
|
MTBF | >168H |
| MTBA | >2H | |
| MTTA | <5 min | |
| MTTR | <30 min | |
| Drop Rate | ≤0.01% | |
| Fragmentation Rate | ≤0.01% | |
| Probe Depth | ≤2 µm | |
| Drain Kelvin | ≤2 Ω |