Titan1000 Probe

Our Titan1000 Probe Pin is engineered with advanced microelectromechanical precision to deliver exceptional accuracy, durability, and electrical performance in semiconductor testing. The top plunger features a new super hard alloy plating, offering superior hardness, wear resistance, and conductivity compared to conventional materials. This innovation ensures stable contact, minimal resistance variation, and a longer service life. Designed for high-frequency and fine-pitch applications, our Titan1000 Probe Pin provides consistent and reliable performance across both wafer-level and package-level test environments.

Test Probe Parallax BG T1k Probe Pin

Titan 1K Special Alloy Probe Pin

Micro fabricated probe pin technology for accurate, repeatable testing.

Test Probe Parallax BG T1k Probe Pin

Titan 1K Special Alloy Probe Pin

Micro fabricated probe pin technology for accurate, repeatable testing.


Titan1000 Probe Pin
Anatomy

Titan 1000 Probe Pin

Top Plunger

• Material : Titan 1000 Alloy

• Plating : Gold Plated

alloy 1
alloy 2

Barrel

• Material : Phosphor Bronze / Brass / Alloy

• Plating : Gold Plated

Spring

• Material : Music Wire / SUS Wire / BeCu Wire

• Plating : Gold Plated

Bottom Plunger

• Material : Pd Alloy / BeCu / SK-4F

• Plating : Gold Plated


Titan1000 Probe Pin
Anatomy

Titan 1000 Probe Pin

Top Plunger

Material: Titan 1000 Alloy

Plating: Gold Plated

Barrel

Material: Phosphor Bronze / Brass / Alloy

Plating: Gold Plated

Spring

Material: Music Wire / SUS Wire / BeCu Wire

Plating: Gold Plated

Bottom Plunger

Material: Pd Alloy / BeCu / SK-4F

Plating: Gold Plated

Why choose Titan1000 pin?

1. High Hardness

T1k Pin
>Hv 1000
T1k Pin
Hv480
Pd Alloy
Hv400
BeCu
Hv : Vickers Hardness

2. Less Abrasion

T1k Pin
Pd Alloy
BeCu
Initial
T1k Pin Initial
Pd Alloy Initial
BeCu Initial
After 1000K
T1k Pin After 1000K
Pd Alloy After 1000K
BeCu After 1000K
Real Image
T1k Pin Real Image
Pd Alloy Real Image
BeCu Real Image
Abrasion Loss
18μm
decrease
41μm
decrease
64μm
decrease

3. Less Resistance Gap. High Stability Resistance.

200 180 160 140 120 100 80 60 40 20 0 0K 100K 200K 300K 400K 500K 600K 700K 800K 900K 1000K Touch Down Resistance (mΩ) T1k Pin Pd Alloy BeCu Initial Resistance 67mΩ After 100K Resistance 99mΩ Gap Resistance 32mΩ

Normal Pin & T1K Pin Comparison

Initial
Image
After 300K
LTT Image
EDS

Normal & Pd Alloy Pin

Normal and Pd Alloy Pin

Titan 1000 Pin

Titan 1000 Pin
Initial
Image
After 300K
LTT Image
EDS
Conclusion
Rapid Debris Deposition (Rough Surface)
Anti-solder migration & less contamination (Smooth Surface)

Product Specification

Pyramid Tip

Pyramid Tip

Package Type

pyramid type

QFN                 QFP    

2 2 png

0.35mm ~ 0.50mm

Available Pitch

3 2 png

50mΩ~80mΩ

Contact Resistance

4 2 png

1.3A ~ 2.0A

Current Carrying Capacity

5 2 png

-55°C ~ 150°C

Operating Temperature

Crown Tip

Crown Tip

Package Type

1 2 png

BGA

2 2 png

0.35mm ~ 0.50mm

Available Pitch

3 2 png

50mΩ

Contact Resistance

4 2 png

1.0A ~ 2.0A

Current Carrying Capacity

5 2 png

-55°C ~ 150°C

Operating Temperature

Product Details

pt table
ct table