ATS offers a wide range of heat sinks for cooling various devices packaged in different components. Our solutions include BGA, LGA, ASIC, and LED cooling in multiple fin designs such as maxiFLOW™, straight fin, pin fin, and cross-cut. The patented maxiFLOW™ design enhances convection cooling, lowering junction temperatures by over 20%. These heat sinks are available with various attachment options, including maxiGRIP™, superGRIP™, push pins, and thermal tape.