ATS has a range of low-profile heat sinks and attachment methods for electronics systems with limited space and airflow. From ultra-low-profile blueICE™ heat sinks to low-profile maxiFLOW™ and straight-fin heat sinks, ATS has solutions for tough-to-cool components deployed in systems such as telecommunications and IoT where space is at a premium. Attachment methods include thermal tape, or ATS high-performance maxiGRIP™ and superGRIP™ systems require no holes on a PCB.