


MEMS Probe
Our MEMS Probe Pin is engineered with advanced microelectromechanical (MEMS) precision to deliver exceptional accuracy, durability, and electrical performance in semiconductor testing. The top plunger features a new super hard alloy plating, offering superior hardness, wear resistance, and conductivity compared to conventional materials. This innovation ensures stable contact, minimal resistance variation, and a longer service life. Designed for high-frequency and fine-pitch applications, our MEMS Probe Pin provides consistent and reliable performance across both wafer-level and package-level test environments.
Why choose MEMS pin?
Product Advantages:
1. High Hardness – Long Life Span

2. Consistent CRES (Contact Resistance)

3. Smooth Surface

Product Specification

Pyramid Tip
Package Type

QFN LGA

0.35mm ~ 0.50mm
Available Pitch

50mΩ
Contact Resistance

1.3A ~ 2.0A
Current Carrying Capacity

-55°C ~ 150°C
Operating Temperature

Crown Tip
Package Type

BGA

0.35mm ~ 0.50mm
Available Pitch

50mΩ
Contact Resistance

1.0A ~ 2.0A
Current Carrying Capacity

-55°C ~ 150°C
Operating Temperature
Product Details



