OS7700 – Open Short Tester After Wire Bond
OS7700
Package Size: PBGA 5×5 ~ 40mmx40mm
Product Type: PBGA / Matrix PBGA
Applicable: After wire bonding open short tester machine
The OS7700 is a cutting-edge testing system designed to detect open and short circuits in semiconductor devices after the wire bonding process. This advanced technology ensures precise and reliable testing, enhancing the quality and performance of semiconductor products. Ideal for modern manufacturing environments, the OS7700 helps reduce defects and improve efficiency, making it a valuable asset for semiconductor production lines.
♦ Using smart open short to tester system, Standard I/O 1024 Pin
♦ The height of the test machine can be expanded to 2048 Pin
♦ Test speed per pin 2ms
♦ Double channel dual area test, channel width Max. 95x240mm
♦ Minimum test solder ball pitch 0.4mm, solder pad Min. 0.2mm
♦ With defective product re-test function
♦ Defective product mark has been represented by map
♦ Use CCD to visually correct the alignment between pogo pin and substrate
♦ Use the quick-release one touch kit, and the machine change time is within 20 minutes
♦ UPH 1.0K