OS7300 – PBGA Open Short Tester After Wire Bond
OS7300
Package Size: PBGA 17×17 ~ 40mmx40mm
Product Type: PBGA substrate type
Applicable: After wire bonding open short tester
The OS7300 is a high-precision Open/Short Tester engineered for Plastic Ball Grid Array (PBGA) packages after the wire bonding process. It ensures accurate detection of electrical faults such as open circuits and short circuits, helping manufacturers maintain quality and yield in semiconductor packaging.
♦ Using smart open short to test the system, Standard I/O 1024 Pin
♦ The height of the test machine can be expanded to 2048 pin
♦ Test speed per pin 2ms
♦ Single-channel dual-zone test, channel width Max. 70mm
♦ Minimum test solder ball pitch 0.8mm
♦ With defective product re-test function
♦ Defective products are marked in the form of a map
♦ Max. UPH 1.2K
♦ Use Load board to test