PB6400
KGD Die Handler
Semight PB6400 KGD Die Handler can be mainly used for power chip Die-level dynamic and static test to implement the screening of chip performance indicators and improve the first pass yield of the module after packaging. The testers in the corresponding specifications can be configured by test items, test conditions and test parameters. According to customer requirements, can supports the customized development. The system supports a variety of chip packaging methods, such as blue tap, Waffle Pack and Tape &Reel.
- The flexible design is adopted – The handler with transport part is separated from the test part, so the strong expandability is provided
- Multiple parallel test – Maximum of 4 test stations are supported, and the different test station support different test conditions and items
- Support dynamic and static parameter test – 2000V/200A static test, 2000V/1500A dynamic test
- High temperature stability – Room temperature ~ 185 ℃：high-temperature stability ≤ ±3 ℃, resolution 0.1 ℃
| Parameter | Indicators |
| Applicable products | SiC chip |
| Wafer size | 6 inches and 8 inches |
| Static parameters | Vds, Vth, Idss, Igss, Rds(on), Vsd |
| Dynamic parameter | Eas, Rint, Ciss, Coss, Crss, Eoss |
| Switch parameter | Isc, Td(on), Tr, Tf(off), Tf, Eon, Eoff, Trr, Qrr, Irrm, |
| System power consumption | <10kW |
| Nitrogen protection | 2~5Bar |
| Temperature range | Room temperature~200℃ |
| Number of AC test stations | Number of test stations which support customization |
| Number of DC test stations | Number of test stations which support customization |
| Current and voltage overshoot | No overshoot under any circumstances |
| MES docking | Support MES docking |