PB6600

SiC KGD Die Handler

Semight PB6600 KGD Die Handler can be mainly used for power chip Die-level dynamic and static test to implement the screening of chip performance indicators and improve the first pass yield of the module after packaging. The testers in the corresponding specifications can be configured by test items, test conditions and test parameters. According to customer requirements, can supports the customized development. The system supports frame ring input and output.

  • Strong expandability – The handler with transport part (PB6600) is separated from the test part
  • Six parallel tests – Support up to 6 test stations, different test stations support different test conditions and items
  • Dynamic and static test – Static test 2000V/600A, Dynamic test 1200V/2000A
  • Accurate test results – Room temperature ~ 200 ℃, accuracy<±3°C,resolution:0.1°C
  • Hard docking – Stray inductance of the dynamic test system≤50nH
  • Nitrogen pressure test – The sealed cavity design is adopted for the probe card, with the nitrogen pressure monitoring function, which can maintain pressure and prevent arcing
  • UPH capability >1400pcs – Single test station test time≤1s

Static parameter test list

Test type Item Description
Static test parameters
(more parameters according tester)
Vds Drain – Source Voltage
Vth Gate Threshold Voltage
Idss Zero Gate Voltage Drain Current
Igss Gate-Source Leakage Current
Rds(on) Drain-Source On-State Resistance
Vsd Diode Forward Voltage

Dynamic test parameter list

Test type Item Description
UIS test parameters
(more parameters according tester)
Rint Gate Input Resistence
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
Eoss Coss Stored Energy
AC Characteristics
(more parameters according tester)
Isc Short-circuit Current
Td(on) Turn-On Delay Time
Tr Rise Time
Tf(off) Turn-Off Delay Time
Tf Fall Time
Eon Turn Off Switching Energy
Eoff Fall Time
Trr Reverse Recovery Time
Qrr Reverse Recovery Charge
Irrm Peak Reverse Recovery Current