DS7000 – PBGA Dispenser Die Attach Machine
DS7000
Package Size: 5×5 ~ 50mmx50mm
Product Type: PBGA / matrix FBGA
Application: PBGA Product Dispensers and Heat Sink Attach
The DS7000 PBGA Dispenser Die Attach Machine is a precision dispensing system specifically designed for die attach applications in Plastic Ball Grid Array (PBGA) packaging. Engineered for high-throughput and repeatable accuracy, the DS7000 provides controlled adhesive dispensing to ensure optimal thermal and mechanical bonding. Its advanced motion platform, fine pitch capability, and programmable dispensing parameters make it ideal for complex semiconductor packaging processes. This system supports a wide range of die sizes and adhesive materials, improving yield and reliability in high-volume production environments.
♦ The machine is equipped with a dual-track single pneumatic dispensing head, designed with three heat sink suction nozzles.
♦ Pneumatic dispensing precision is 10mg±10%
♦ Dispensing capability: single dot diameter 0.8±0.1mm
♦ 2Kx2K CCD for visual orientation recognition and dispensing quality inspection
♦ Operating substrate range: Length (150~280mm); Width (30~100mm)
♦ Adjustable flow channel range: 32~162mm
♦ The heat sink suction nozzle head allows for a product rotation angle correction of up to 5 degrees
♦ Heat sink attachment position accuracy: ±75μm
♦ Machine X, Y axis accuracy ±25μm
♦ The machine has SECS/GEM System