Ultra-Cool Active and Passive Solutions for High Powered Devices
ATS has designed a family of ultra-high-performance active and passive coolers for high-powered processors, such as AI Processors, CPUs, FPGAs, and GPUs. Argus™ and cryoQOOL™ are ultra high peformance, active cooling solutions for the highest performing applications.
dualFLOW™ and quadFLOW™ use a blower to provide additional airflow at the device level. dualFLOW™ pulls air in from two sides, while quadFLOW™ has a unique design that enables air to be pulled across the device from four sides, providing higher thermal performance than other fan-ready heat sinks on the market. These are perfect for systems with constrained airflow.
ATS also has heat sinks that take advantage of system airflow to provide cooling of high-powered devices, available in blue anodized aluminum or nickel-plated copper depending on the thermal and weight restrictions of your project.
The following table details the full family of Ultra-Cool, High-Performance Coolers. Scroll down for more information about the active or passive solutions that ATS has to offer.
* If you need Datasheet, CAD or RoHS, please contact us.
| Part Number | Lifecycle Status |
Max TDP (W) |
R (°C/W) | Dimension (mm) | Fin Material |
Finish | Weight (g) |
Application Notes | ||
|---|---|---|---|---|---|---|---|---|---|---|
| L | W | H | ||||||||
| ATS-ARGUS-D200 | ACTIVE | 229 | 0.14 | 121 | 121 | 64 | Cu | Nickel Plated | 970 | Designed for cooling dense 2U applications, provides at least 20% improvement over comparable products on the market. Minimum Chassis Height for Cooler is 2U |
| ATS-UC-CRYQL-100 | ACTIVE | 267 | 0.12 | 137 | 97.6 | 47.8 | Cu | None | 1610 | Designed for cooling dense 2U applications, provides at least 50% improvement over comparable products on the market. Minimum Chassis Height for Cooler is 2U |
| ATS-UC-DFLOW-100 | ACTIVE | 160 | 0.20 | 92.38 | 92.11 | 29 | Al | Nickel Plated | 436 | For less-resticted PCB layouts,aluminium fins reduce weight and air enters the heat sink from two directions |
| ATS-UC-DFLOW-200 | ACTIVE | 170 | 0.19 | 92.38 | 92.11 | 29 | Cu | Nickel Plated | 566 | For less-dense PCB layouts, copper fns improve heat spreading and air enters heat sink from two directions. |
| ATS-UC-DFLOW-VC-200 | ACTIVE | 160 | 0.20 | 92.38 | 92.11 | 29 | Cu | Nickel Plated | 479 | For less-dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from two directions |
| ATS-UC-NF-100 | ACTIVE | 97 | 0.33 | 90 | 90 | 28 | AL | Blue Anodized | 190 | Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight |
| ATS-UC-NF-101 | ACTIVE | 105 | 0.31 | 90 | 90 | 28 | AL | Blue Anodized | 242 | Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight |
| ATS-UC-NF-200 | ACTIVE | 150 | 0.21 | 90 | 90 | 28 | Cu | Nickel Plated | 728 | Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight |
| ATS-UC-NF-201 | ACTIVE | 190 | 0.17 | 90 | 90 | 28 | Cu | Nickel Plated | 808 | Ideal for 1U systems with open airflow front to back, copper fins reduce spreading resistance |
| ATS-UC-QFLOW-100 | ACTIVE | 152 | 0.21 | 92.38 | 92.11 | 29 | AL | Nickel Plated | 456 | For PCB layouts with restricted airflow, aluminum fins reduce, weight and air enters the heat sink from four directions |
| ATS-UC-QFLOW-200 | ACTIVE | 160 | 0.20 | 92.38 | 92.11 | 29 | Cu | Nickel Plated | 580 | For dense PCB layouts, copper fins improve heat spreading and air enters heat sink from four directions |
| ATS-UC-QFLOW-VC-200 | ACTIVE | 160 | 0.20 | 92.38 | 92.11 | 29 | Cu | Nickel Plated | 493 | For dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from four directions |