UA1000 – Under Fill AOI Inspection
UA1000
Package Size: 7×7 ~ 110mmx110mm
Carry Boat: 137mmx322mm ~ 160mmx320mm
Product Type: FCBGA Products
Applications: FCBGA products after Under Fill quality inspection
The UA1000 Under Fill AOI Inspection system offers high-precision automated optical inspection (AOI) specifically designed for underfill processes in semiconductor packaging and electronics manufacturing. Using advanced imaging and AI-driven defect detection, the UA1000 ensures accurate identification of voids, insufficient coverage, contamination, and other underfill-related defects.
♦ CCD 20M deteciton system FOV 60x60mm single pixel 13μm
♦ Light source configuration coaxial light and low angle light
♦ The machine can be equipped with Loader/Un-Loader separately to become a single machine
♦ The machine can be connected with the Under Fill machine
♦ CCD Z-axis auto focus
♦ The machine has SECS / GEM and 2D Barcode functions
♦ Chip contamination, glue breakage, overflow creeping, substrate contamination, component contamination