WR1000 – Wafer Internal Crack Inspection Machine
WR1000
Product Range: 8~12 inch wafer
Application: Wafer internal crack detection of cutting line
The WR1000 Wafer Internal Crack Inspection Machine is a cutting-edge inspection system designed to detect internal cracks and defects in semiconductor wafers during the manufacturing process. Utilizing advanced imaging technology, it ensures precise identification of wafer integrity issues, improving quality control, minimizing defects, and enhancing yield in semiconductor production.
♦ The machine uses a water mirror to detect
♦ Machine detection FOV 1.6×1.2mm single pixel 2.5μm
♦ Using IR CCD system with 10x objective lens detection
♦ Offline inspection and modification function
♦ Barcode file opening corresponds to map image file
♦ With 12-inch to 8-inch Wafer ring operation jig