


WLR3500
WLR3500 – Semight Instruments Wafer Level Burn-In System
The WLR3500 Wafer Level Burn-in System is a high-end, specialized SiC wafer burn-in testing solution capable of performing High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) burn-in on up to 6 wafers simultaneously. It supports a wide range of burn-in durations, from a few minutes to several hours, and can extend to thousands of hours, meeting the burn-in requirements of various products. The system allows configurable burn-in conditions and precise threshold voltage (Vth) measurement for each die. Each channel is equipped with independent overcurrent protection to ensure device safety. The system also generates mapping analysis data (Map data) to facilitate detailed performance analysis and quality control. It offers flexible configuration options for R&D applications and is well-suited for high-capacity production.
WLR3500 – Semight Instruments Wafer Level Burn-In System
- Automatic Burn-In Switching – Support the automatic switching of GB and RB burn-in for up to six wafers simultaneously.
- Independent Temperature Control and Power Supply – Each drawer is equipped with its own temperature control and power supply system.
- Wide Voltage Range – Support HTGB voltage of ±70V and HTRB voltage of less than 2000V.
- Multi-Channel Support – The entire system supports up to 4320 channels (720*6), achieving high parallelism in burn-in testing.
- High-Precision Testing – During the burn-in process, the system offers a leakage current resolution of up to 0.1nA.
- Arcing Protection – A high-reliability gas protection system with ~3 bar atmospheric pressure is provided, effectively preventing oxidation and arcing during the burn-in process.
- Real-Time Monitoring and Testing – Support real-time monitoring of key parameters such as Igss, Idss and also supports Vth testing.
- Wide Temperature Range – The temperature control range extends from 40°C to 175°C.
Functions and advantages
System Configuration
The system can accommodate up to 6 single layers, with each layer equipped with a dedicated fixture. Every layer is independently controlled and operate in different modes. Different burn-in can be performed simultaneously with different burn-in plans.

The configuration of the WLR3500(RB+GB)system is as follows:
| No. | Module | Part Number | Description |
| 1 | System Cabinet | WLR3500-M | Main system + software, HTGB+HTRB
Note:HTGB+HTRB:max.6 layers |
| 2 | WLBI Single Layer | WLR3500-L | – Automatic switching between HTGB and HTRB
– Scanning of Igss and Idss leakage currents – Integrated with Vth test – Configured with flexible Burn-In plan – Integrated with map data and interface with CP test – High density probe card with high voltage chuck – Reliable and precise heating and temperature control system – 6-inch wafer – Single touch for all dies burn-in, up to 720 dies – 1 year warranty Note:max. 6 layers of HTGB+HTRB |
| 3 | WLBI Test Fixture | WLR3500-F | – Dedicated for SiC wafer level burn-in with HTGB and HTRB
– 6-inch wafer |
| 4 | Wafer Aligner System | AL3500A | – Assists operators in wafer alignment and fixture installation
– Supports automatic loading/unloading of 6-inch wafer |
The configurations of the WLR3500(GB)system is as follows:
| No. | Module | Part Number | Description |
| 1 | System Cabinet | WLR3500-M | Main system + software, HTGB+HTRB
Note:HTGB+HTRB:max. 6 layers |
| 2 | WLBI Single Layer | WLR3500-L | – Automatic switching between HTGB and HTRB
– Scanning of Igss and Idss leakage currents – Integrated with Vth test – Configured with flexible Burn-In plan – Integrated with map data and interface with CP test – High density probe card with high voltage chuck – Reliable and precise heating and temperature control system – 6-inch wafer – Single touch for all dies burn-in, up to 720 dies – 1 year warranty Note:max. 6 layers of HTGB+HTRB |
| 3 | WLBI Test Fixture | WLR3500-F | – Dedicated for SiC wafer level burn-in with HTGB and HTRB
– 6-inch wafer |
| 4 | WLBI Aligner System | AL3500A | – Assists operators in wafer alignment and fixture installation
– Supports automatic loading/unloading of 6-inch wafer |
