These heat sinks are engineered with thin, dense fields of pin-shaped cooling fins. The pin fin design provides excellent cooling in spatially constrained PCB layouts when the direction of the airflow near the device is ambiguous The high efficiency pin design provides low pressure drop to optimize cooling airflow. Concentrated pins provide a large surface area to increase performance. The heat sinks can be attached with double-sided thermal adhesive tape, Z-clips or the ATS maxiGRIP™ system.