♦ CCD 25M detection system FOV 60x60mm single pixel 12μm
♦ Die Bond offset detection accuracy +/- 5μm
♦ Die Crack detection accuracy 14μm
♦ Die Chipping detection accuracy 45μm
♦ With Component presence, absence, and offset detection functions
♦ With marking detection function
♦ SECS/GEM system
♦ 2D Bar Code reading function