
Open Short Tester After Wire Bond ( OS7700 )
OS7700
Package Size: PBGA 5×5 ~ 40mmx40mm
Product Type: PBGA / Matrix PBGA
Applicable: After wire bonding open short tester machine
♦ Using smart open short to tester system, Standard I/O 1024 Pin
♦ The height of the test machine can be expanded to 2048 Pin
♦ Test speed per pin 2ms
♦ Double channel dual area test, channel width Max. 95x240mm
♦ Minimum test solder ball pitch 0.4mm, solder pad Min. 0.2mm
♦ With defective product re-test function
♦ Defective product mark has been represented by map
♦ Use CCD to visually correct the alignment between pogo pin and substrate
♦ Use the quick-release one touch kit, and the machine change time is within 20 minutes
♦ UPH 1.0K