
PBGA Open Short Tester After Wire Bond (OS7300)
OS7300
Package Size: PBGA 17×17 ~ 40mmx40mm
Product Type: PBGA substrate type
Applicable: After wire bonding open short tester
♦ Using smart open short to test the system, Standard I/O 1024 Pin
♦ The height of the test machine can be expanded to 2048 pin
♦ Test speed per pin 2ms
♦ Single-channel dual-zone test, channel width Max. 70mm
♦ Minimum test solder ball pitch 0.8mm
♦ With defective product re-test function
♦ Defective products are marked in the form of a map
♦ Max. UPH 1.2K
♦ Use Load board to test