Wide variety of heat sinks for cooling different devices that are packaged in a variety of components
ATS offers a broad array of heat sinks for cooling of different devices that are packaged in a variety of components. BGA, LGA, ASIC and LED cooling solutions are offered in a variety of fin types, including maxiFLOW™, straight fin, pin fin and cross cut designs. maxiFLOW’s patented flared fin design, maximizes effective convection cooling and reduces junction temperatures by more than 20%. These heat sinks are available with a variety of heat sink attachment options, including maxiGRIP™, superGRIP™, push pins and thermal tape.