Heat Sinks For Texas Instruments

ATS heat sink family are optimized for natural convection air cooling

Texas Instruments Incorporated designs and manufactures analog technologies, digital signal processing (DSP) and microcontroller (MCU) semiconductors. TI is a leader in semiconductor solutions for analog and digital embedded and applications processing and sought out ATS’ innovative heat sink technology to design a solution specific for TI’s Audio Evaluation Modules. ATS’ heat sinks are optimized for natural convection air cooling. This black anodized finish allows for maximum heat dissipation

Dimensions
Length (A) 50.0 – 78.0 mm
Width (B) 13.0 – 36.0 mm
Height (C) 2.0 – 35.6 mm
  • Designed specifically for TI’s Audio Evaluation Modules
  • Heat sinks come with 2 4-40 taped threaded holes
  • Optimized for natural convection air cooling
  • Black anodized for maximum heat dissipation

* If you need Datasheet, CAD or RoHS, please contact us.

Part Number Lifecycle
Status
Dimension (mm) Thermal Resistance (R,°C/W) at Air
Velocity(V,ft/min.)
R (Natural Convection)
°C/W
R (200 ft/min.)
°C/W Ducted
Fin Tip
L W H V=200 V=400 V=600 V=800
ATS-TI1OP-1099-C1-R1 ACTIVE 36.0 78.0 36.5 2.2 1.6 1.4 1.2 N/A N/A N/A
ATS-TI1OP-1918-C1-R0 ACTIVE 20.0 41.4 32.8 4.6 3.4 2.8 2.5 N/A 3.4 32.5
ATS-TI1OP-518-C1-R0 ACTIVE 36.0 78.0 28.1 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-518-C1-R1 ACTIVE 36.0 78.0 28.1 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-519-C1-R0 ACTIVE 36.0 78.0 35.6 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-519-C1-R1 ACTIVE 36.0 78.0 35.6 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-519-C1-R2 ACTIVE 36.0 78.0 35.6 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-519-C1-R3 ACTIVE 36.0 78.0 35.6 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-521-C1-R0 ACTIVE 13.9 50.0 25.0 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-521-C1-R1 ACTIVE 13.9 50.0 25.0 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-521-C2-R0 ACTIVE 13.9 50.0 25.0 N/A N/A N/A N/A N/A N/A N/A
ATS-TI1OP-563-C1-R0 ACTIVE 36.0 54.0 35.6 N/A N/A N/A N/A N/A N/A N/A