Wafer Internal Crack Inspection Machine ( WR1000 )
WR1000
Product Range: 8~12 inch wafer
Application: Wafer internal crack detection of cutting line
♦ The machine uses a water mirror to detect
♦ Machine detection FOV 1.6×1.2mm single pixel 2.5μm
♦ Using IR CCD system with 10x objective lens detection
♦ Offline inspection and modification function
♦ Barcode file opening corresponds to map image file
♦ With 12-inch to 8-inch Wafer ring operation jig