WLBI370A
Wafer Level Burn-in System
The WLR3500 Wafer Level Burn-in System is a high-end, specialized SiC wafer burn-in testing solution capable of performing High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) burn-in on up to 6 wafers simultaneously. It supports a wide range of burn-in durations, from a few minutes to several hours, and can extend to thousands of hours, meeting the burn-in requirements of various products. The system allows configurable burn-in conditions and precise threshold voltage (Vth) measurement for each die. Each channel is equipped with independent overcurrent protection to ensure device safety. The system also generates mapping analysis data (Map data) to facilitate detailed performance analysis and quality control. It offers flexible configuration options for R&D applications and is well-suited for high-capacity production.
- Fully Automated System – Automated wafer and fixture loading/unloading without manual intervention
- High Throughput – Supports simultaneous HTGB burn-in of up to 20 wafers at full capacity
- High Compatibility – Easy switching between 6-inch and 8-inch wafers by replacing fixtures
- Independent Temperature Control – Each drawer is equipped with independent temperature control and power systems, ensuring precise and stable burn-in conditions for each wafer.
- Multi-Channel Testing – Supports up to 1,500 channels per layer for burn-in. Burn-in channel capacity can be expanded via second touchdown
- High-Precision Testing –0.1nA leakage current resolution
- Wide Temperature Range – Temperature control ranges from 40°C to 175°C
- Comprehensive System Features –Real-time monitoring of Igss and Vth testing. Robust hardware protection against overcurrent and overvoltage.
Functions and advantages
The system combines the form of integrated machine with Burn-In system and feeding/unloading system. This equipment provides more Burn-In channels, supporting simultaneous Burn-In of up to 1500 channels per wafer. It also offers more Burn-In drawers, supporting Burn-In of 20 drawers (wafers) simultaneously. By replacing different Burn-In fixtures and supporting fixtures, it enables rapid switching between aging requirements for 6-inch and 8-inch wafers.
The specific configuration is as follows:
| Suitable for | SiC Wafer |
| Applicable Packages | 6-inch, 8-inch Wafer |
| Burn in Type | HTGB |
| Test Parameters | Igss, Vth |
| System Size | 3000mm(W) X 2500mm(H) X 4500mm(D) |
| Nitrogen Protection | Yes |
| Temperature range | 45°C to 175°C |
| Voltage Range | Gate ±70V |
| System Channels/ Layer | 1500 |
| System Layers | 20 |
| Supports Cassette Feeding | Up to 50 PCS
(Uploading area: 2 cassettes, with 1 cassette: |
| Power Supply | 380V, 20A three-phase, 50-60Hz |
| Software System | Windows |
| Software Language Environment | VS/C# |